Littelfuse SP3010 Series - Manual (Page 4)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
TVS Diode Arrays
(SPA ® Diodes)
Low Capacitance ESD Protection - SP3010 Series
Embossed Carrier Tape & Reel Specification — µDFN-10
Package Dimensions — µDFN-10 (2.5x1.0x0.5mm)
Package µ DFN-10 (2.5x1.0x0.5mm)
Symbol Millimeters
A0 1.30 ± 0.10
B0 2.83 ± 0.10
D0 Ø 1.50 + 0.10
D1 Ø 1.00 + 0.25
E 1.75 ± 0.10
F 3.50 ± 0.05
K0 0.65 ± 0.10
P0 4.00 ± 0.10
P1 4.00 ± 0.10
P2 2.00 ± 0.05
T 0.254 ± 0.02
W 8.00 + 0.30 /- 0.10
K0
A0
B0
P2
P1
P0
T
F
E
W
D0
D1
5º Max
5º Max
User Feeding Direction
Pin 1 Location
Package µ DFN-10 (2.5x1.0x0.5mm)
JEDEC MO-229
Symbol
Millimeters Inches
Min Nom Max Min Nom Max
A 0.48 0.515 0.55 0.019 0.020 0.021
A1 0.00 -- 0.05 0.000 0.022
A3 0.125 Ref 0.005 Ref
b 0.15 0.20 0.25 0.006 0.008 0.012
b1 0.35 0.40 0.45 0.014 0.016 0.018
D 2.40 2.50 2.60 0.094 0.098 0.102
E 0.90 1.00 1.10 0.035 0.039 0.043
e 0.50 BSC 0.020 BSC
L 0.30 0.365 0.43 0.012 0.014 0.016
D
E
B
Top View
A
A
Bottom View
0.05 C
b
A1
b1
A3
C
Seating
Plane
Side View
0.10 C A M B
0.05 C M
L
e
2xR0.075mm (7x)
R0.125
0.05 C
X1
X
P
P1
Z (C) G
Y
(Y1)
Soldering Pad Layout
Recomended
D
E
B
Top View
A
A
Bottom View
0.05 C
b
A1
b1
A3
C
Seating
Plane
Side View
0.10 C A M B
0.05 C M
L
e
2xR0.075mm (7x)
R0.125
0.05 C
X1
X
P
P1
Z (C) G
Y
(Y1)
Soldering Pad Layout
Recomended
Soldering Pad Layout Dimensions
Inch Millimeter
C (0.034) (0.875)
G 0.008 0.20
P 0.020 0.50
P1 0.039 1.00
X 0.008 0.20
X1 0.016 0.40
Y 0.027 0.675
Y1 (0.061) (1.55)
Z 0.061 1.55
X1
X
P
P1
Z (C) G
Y
(Y1)
Soldering Pad Layout
Alternative