Littelfuse 250R Series - Manual (Page 4)

100
Revised: August 31, 2011
POLY-FUSE ® Resettable PTCs
© 2011 Littelfuse, Inc.
250R Series
Radial Leaded > 250R Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/250R.html for current information.
Environmental Specifications
Operating/Storage
Temperature
¡$UP¡$
Maximum Device Surface
Temperature in Tripped State
¡$
Passive Aging ¡$¡$
IPVST
Humidity Aging ¡$
3)
IPVST
Thermal Shock
.*-o45%o'
.FUIPE(
¡$UP¡$UJNFT
Solvent Resistance .*-o45%o
.FUIPE'
Moisture Sesitivity Level -FWFM
+o45%o$
Physical Specifications
Lead Material Tin-plated Copper
Soldering
Characteristics 4PMEFSBCJMJUZQFS.*-o45%o
Method 208E
Insulating Material
$VSFE
nBNFSFUBSEBOUFQPYZQPMZNFS
NFFUT6-7SFRVJSFNFOUT
Device Labeling
.BSLFEXJUIh-'h
WPMUBHF
DVSSFOUSBUJOH
and date code.
Soldering Parameters - Wave Soldering
Condition 8BWF4PMEFSJOH
Peak Temp/ Duration Time ¡$< 5 Sec
> 220°C 2 Sec ~ 20 Sec
Preheat 140°C ~ 180°C 180 Sec ~ 210 Sec
Storage Condition ¡$_¡$<3)
t3FDPNNFOEFETPMEFSJOHNFUIPETIFBUFMFNFOUPWFOPS
N
2
environment for lead-free.
t%FWJDFTBSFEFTJHOFEUPCFXBWFTPMEFSFEUPUIFCPUUPN
side of the board.
t%FWJDFTDBOCFDMFBOFEVTJOHTUBOEBSEJOEVTUSZNFUIPET
and solvents.
t5IJTQSPmMFDBOCFVTFEGPSMFBEGSFFEFWJDF
Note:*GTPMEFSJOHUFNQFSBUVSFTFYDFFEUIFSFDPNNFOEFE
profile, devices may not meet the performance
requirements.
Preheating
160
190
220
260
0
2 to 5
Temperature (
°C)
Soldering Cooling
20-30 180 to 210
Time(s)