Littelfuse SP724 Lead-Free_Green Series - Manual (Page 5)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
TVS Diode Arrays
(SPA ® Diodes)
General Purpose ESD Protection - SP724 Series
Package Dimensions — Small Outline Transistor Plastic Packages (SOT23-6)
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat Preheat
Ramp-up Ramp-up
Ramp-down Ramp-do
Critical Zone
T L to T P
Critical Zone
T L to T P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
5°C/second max
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
Package SOT23-6
Pins 6
JEDEC MO-178
Millimeters Inches
Notes
Min Max Min Max
A 0.900 1.450 0.035 0.057 -
A1 0.000 0.150 0.000 0.006 -
A2 0.900 1.300 0.035 0.051 -
b 0.350 0.500 0.0138 0.0196 -
C 0.080 0.220 0.0031 0.009 -
D 2.800 3.000 0.11 0.118 3
E 2.600 3.000 0.102 0.118 -
E1 1.500 1.750 0.06 0.069 3
e 0.95 Ref 0.0374 ref -
e1 1.9 Ref 0.0748 Ref -
L 0.100 0.600 0.004 0.023 4,5
N 6 6 6
a 0º 10º 0º 10º -
M 2.590 0.102 -
O 0.690 .027 TYP -
P 0.990 .039 TYP -
R 0.950 0.038 -
O
P
R
M
Recommended Solder Pad Layout