Littelfuse 1812L Series - Manual (Page 3)

POLY-FUSE ® Resettable PTCs
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/05/13
1
81
2L S
eries
Surface Mount > 1812L Series
Temperature Rerating Curve
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 85
10%
30%
50%
70%
90%
110%
130%
150%
170%
Temperature (°C)
Percentage of Rated Current
Environmental Specifications
Operating/Storage Temp. -40°C to +85°C
Max. Device Surface Temp.
in Tripped State
125°C
Passive Aging
+85°C, 1000 hours
-/+5% typical resistance change
Humidity Aging
+85°C, 85% R.H.,1000 hours
-/+5% typical resistance change
Thermal Shock
MIL–STD–202, Method 107G
+85°C/-40°C 20 times
-30% typical resistance change
Solvent Resistance
MIL–STD–202, Method 215,
No change
Vibration
MIL–STD–883C, Method 2007.1,
Condition A, No change
Moisture Level Sesitivity Level 1, J–STD–020C
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin (Sn))
Lead Solderability
Meets EIA Specification RS186-9E, ANSI/
J-STD-002 Category 3.
Soldering Parameters
Condition Reflow
Peak Temp/ Duration Time 260°C / 10 Sec
Time above liquids (TAL) 220°C 60 Sec ~ 100 Sec
Preheat 120°C~ 180°C 50 Sec ~ 150 Sec
Storage Condition 0°C~35°C, <=70%RH
• Recommended reflow methods: IR, vapor phase oven, hot air
oven, N
2
environment for lead–free
• Recommended maximum paste thickness is 0.25mm (0.010 inch)
• Devices can be cleaned using standard industry methods and
solvents.
Note: If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
Preheating
120
180
220
260
0
60 to 100
Temperature
(°
C)
Soldering Cooling
120 50 to 150
Time(s)