Tvs diode arrays, General purpose esd protection - sp723 series, Diodes) – Littelfuse SP723 Lead-Free_Green Series User Manual
Page 5: Soldering parameters
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
TVS Diode Arrays
(SPA
®
Diodes)
General Purpose ESD Protection - SP723 Series
Package Dimensions — Dual-In-Line Plastic Packages (PDIP)
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat
Preheat
Ramp-up
Ramp-up
Ramp-down
Ramp-do
Critical Zone
T
L
to T
P
Critical Zone
T
L
to T
P
Reflow Condition
Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
)
150°C
- Temperature Max (T
s(max)
)
200°C
- Time (min to max) (t
s
)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
5°C/second max
T
S(max)
to T
L
- Ramp-up Rate
5°C/second max
Reflow
- Temperature (T
L
) (Liquidus)
217°C
- Temperature (t
L
)
60 – 150 seconds
Peak Temperature (T
P
)
260
+0/-5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate
5°C/second max
Time 25°C to peak Temperature (T
P
)
8 minutes Max.
Do not exceed
260°C
Soldering Parameters
CL
E
e
A
C
e
B
e
C
-B-
E1
INDEX
1 2 3
N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A
1
-A-
0.010 (0.25)
C A
M
B S
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and
are measured with the leads constrained to be per-
pendicular to datum
.
7. e
B
and e
C
are measured at the lead tips with the leads uncon-
strained. e
C
must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
e
A
-C-
Package
PDIP
Pins
8
JEDEC
MS-001
Millimeters
Inches
Notes
Min
Max
Min
Max
A
-
5.33
-
0.210
4
A1
0.39
-
0.015
-
4
A2
2.93
4.95
0.115
0.195
-
B
0.356
0.558
0.014
0.022
-
B1
1.15
1.77
0.045
0.070
8, 10
C
0.204
0.355
0.008
0.014
-
D
9.01
10.16
0.355
0.400
5
D1
0.13
-
0.005
-
5
E
7.62
8.25
0.300
0.325
6
E1
6.1
7.11
0.240
0.280
5
e
2.54 BSC
0.100 BSC
-
e
A
7.62 BSC
0.300 BSC
6
e
B
-
10.92
-
0.430
7
L
2.93
3.81
0.115
0.150
4
N
8
8
9
Notes:
1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions,
the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane
gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.010 inch (0.25mm).
6. E and e
A
are measured with the leads unconstrained to be perpendicular to datum
-C- .
7. e
B
and e
C
are measured at the lead tips with the leads uncon-strained. e
C
must be zero or
greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not
exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1
dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).