Surface mount fuses, Nano, 160 fuse and clip series – Littelfuse 160 Series User Manual
Page 2: Average time current curves, Soldering parameters temperature rerating curve
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/19/13
Surface Mount Fuses
NANO
2®
> 160 Fuse and Clip Series
Average Time Current Curves
Reflow Condition
Pb-free assembly
pre Heat
- Temperature min (T
s(min)
)
150°C
- Temperature max (T
s(max)
)
200°C
- Time (min to max) (t
s
)
60 – 180 seconds
Average Ramp-up Rate (liquidus Temp
(T
l
) to peak)
5°C/second max.
T
S(max)
to T
l
- Ramp-up Rate
5°C/second max.
Reflow
- Temperature (T
l
) (liquidus)
217°C
- Temperature (t
l
)
60 – 150 seconds
peak Temperature (T
p
)
260
+0/–5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate
5°C/second max.
Time 25°C to peak Temperature (T
p
)
8 minutes max.
Do not exceed
260°C
Soldering Parameters
Temperature Rerating Curve
0.001
0.01
0.1
1
10
100
0.1
1
10
100
1000
TIME IN SECONDS
CURRENT IN AMPS
5A
4A
2A
1.5A
1A
.750A
.500A
3.5A
3A
2.5A
Time
Te
mperatur
e
T
P
T
L
T
S
min
25
t
S
t 25ºC to Peak
t
L
t
P
Preheat
T
S
max
Ramp-down
Ramp-up
Critical Zone
T
L
to T
P