Littelfuse SP1010 Series - Manual (Page 4)

©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
58
TVS Diode Arrays
(SPA ™ Family of Products)
Revision: March 20, 2012
SP1010 Series
General Purpose ESD Protection - SP1010 Series
Embossed Carrier Tape & Reel Specification — μDFN-6 (1.25x1.0x0.5mm)
Ordering Information
Part Number Package Marking Min. Order Qty.
SP1010-04UTG μDFN-6 (1.25x1.0x0.5mm) H4 3000
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Part Numbering System
Part Marking System
SP 1010 04 U T G
Series
Number of
Channels
Package
U: μDFN-6
T= Tape & Reel
G= Green
–
Silicon Protection
Array (SPA
TM )
Family of
TVS Diode Arrays
H4
H 4
Product Series Number of Channels
H = SP1010
K0
A0
B0
P2
D1
P0
t
F
E
W
D Symbol
Millimeters Inches
Min Max Min Max
E 1.65 1.85 0.06 0.07
F 3.45 3.55 0.14 0.14
D1 0.50 0.65 0.02 0.03
D 1.50 MIN 0.06 MIN
P0 3.90 4.10 0.15 0.16
10P0 40.0 +/- 0.20 1.57 +/- 0.01
W 7.90 8.30 0.31 0.33
P2 1.95 2.05 0.08 0.08
A0 1.09 1.19 0.04 0.05
B0 1.42 1.52 0.06 0.06
K0 0.71 0.81 0.03 0.03
t 0.25 TYP 0.01 TYP