Littelfuse SMDJ Series User Manual
Smdj series, Transient voltage suppression diodes, Surface mount – 3000w > smdj series
Transient Voltage Suppression Diodes
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/24/14
Surface Mount – 3000W > SMDJ series
AGENCY
AGENCY FILE NUMBER
E230531
The SMDJ series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Description
Maximum Ratings and Thermal Characteristics
(T
A
=25°C unless otherwise noted)
Agency Approvals
Parameter
Symbol
Value
Unit
Peak Pulse Power Dissipation at
T
A
=25ºC by 10/1000µs Waveform
(Fig.2)(Note 1), (Note 2)
P
PPM
3000
W
Power Dissipation on Infinite Heat
Sink at T
A
=50°C
P
M(AV)
6.5
W
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 3)
I
FSM
300
A
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only
V
F
3.5
V
Operating Junction and Storage
Temperature Range
T
J
, T
STG
-55 to 150
°C
Typical Thermal Resistance Junction
to Lead
R
uJL
15
°C/W
Typical Thermal Resistance Junction
to Ambient
R
uJA
75
°C/W
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated above T
A
= 25°C per Fig. 3.
2. Mounted on copper pad area of 0.31x0.31” (8.0 × 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
TVS devices are ideal for the protection of I/O Interfaces,
V
CC
bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic applications.
Applications
Features
• For surface mounted
applications in order to
optimize board space
• Low profile package
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
15kV(Air), 8kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2 (IEC801-2)
• EFT protection of data
lines in accordance with
IEC 61000-4-4 (IEC801-4)
• Built-in strain relief
•
V
BR
@T
J
= V
BR
@25°C × (1+
α
T
x (T
J
- 25))
(αT: Temperature Coefficient)
• Glass passivated chip
junction
• 3000W peak pulse power
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• Excellent clamping
capability
• Low incremental surge
resistance
• Typical I
R
less than 2µA
above 12V
• High temperature
soldering guaranteed:
260°C/40 seconds at
terminals
• Plastic package has
underwriters laboratory
flammability 94V-O
• Meet MSL level1, per
J-STD-020, LF maximum
peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
RoHS
SMDJ Series
Functional Diagram
Bi-directional
Uni-directional
Cathode
Anode
Uni-directional
Bi-directional
Additional Information