Gas discharge tube (gdt) products, Recommended process parameters, Time vs. current for failsafe – Littelfuse SL1024A_B Series User Manual
Page 3: Voltage vs. time characteristic, Time t emperature t
©2010 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
20
Revised: June 28, 2010
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
SL1021A/B, SL1024A/B and PMT8 Series
SL1021A/B, SL1024A/B and PMT8 Series
Time vs. Current for Failsafe
0.5
1
2
3
4
5
6
7
8
9
11
12
13
14
15
10
20
30
60
1
2
5
10
15
30
SL102xA with Failsafe
SL102xB or PMT8 500 Volt Higher Melting Point Solder
SL102xB or PMT8 90 Volt Higher Melting Point Solder
SL102xB or PMT8 350 Volt Higher Melting Point Solder
Voltage vs. Time Characteristic
V
oltage
(V)
Time (ns)
0 200 400 600 800 1000
1200
Max dynamic breakover
voltage
Hold-over voltage
On-State voltage
Reflow Condition
Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
)
150°C
- Temperature Max (T
s(max)
)
200°C
- Time (Min to Max) (t
s
)
60 – 180 secs
Average ramp up rate (Liquidus Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate
5°C/second max
Reflow
- Temperature (T
L
) (Liquidus)
217°C
- Temperature (t
L
)
60 – 150 seconds
Peak Temperature (T
P
)
260
+0/-5
°C
Time within 5°C of actual peak
Temperature (t
p
)
10 – 30 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (T
P
)
8 minutes Max.
Do not exceed
260°C
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Time
T
emperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T
L
to T
P
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
4
0
50
60
70
80
90
100
110
120
130
1
4
0
150
160
170
180
190
200
210
220
230
2
4
0
Time (Seconds)
T
emperature (°C) - Measured on
bottom side
of
board
Cooling Time
Preheat Time
Wave Parameter
Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Temperature Minimum:
100
°
C
Temperature Maximum:
150
°
C
Preheat Time:
60-180 seconds
Solder Pot Temperature:
280
°
C Maximum
Solder Dwell Time:
2-5 seconds
Recommended Process Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: Surge Arrestors with a Failsafe mechanism should be
individually examined after soldering