Littelfuse SP1003 Series - Manual (Page 3)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/22/13
TVS Diode Arrays
(SPA ® Diodes)
General Purpose ESD Protection - SP1003 Series
Transmission Line Pulsing (TLP) Plot
0
2
4
6
8
10
12
14
16
18
20
0 2 4 6 8 10 12 14 16 18
TLP Voltage (V)
TL
P Cu
rr
ent (A
)
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat Preheat
Ramp-up Ramp-up
Ramp-down Ramp-do
Critical Zone
T L to T P
Critical Zone
T L to T P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
0 10 20 30 40 50
Temperature (ºC)
Leakage Current (nA)
Leakage vs. Temperature
Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of
I PP