Littelfuse SP1008 Series - Manual (Page 4)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 10/21/13
TVS Diode Arrays
(SPA ® Diodes)
General Purpose ESD Protection - SP1008 Series
SP 1008 01 W T G
Series
Number of
Channels Package
W: 0201 Flipchip
T= Tape & Reel
G= Green
–
TVS Diode Arrays
(SPA ® Diodes)
0.28
0.30
0.75 0.19
Recommended Solder Pad Footprint A0 K0 B0
T
P0 P1
P2
D
D1
E
F
W
*Sizes in mm
Package Dimensions — 0201 Flip Chip
Symbol
0201 Flipchip
Millimeters Inches
Min Typ Max Min Typ Max
A 0.595 0.620 0.645 0.0234 0.0244 0.0254
B 0.295 0.320 0.345 0.0116 0.0126 0.0136
C 0.245 0.275 0.305 0.0096 0.0108 0.0120
D 0.145 0.150 0.155 0.0057 0.0059 0.0061
E 0.245 0.250 0.255 0.0096 0.0098 0.0100
F 0.245 0.250 0.255 0.0096 0.0098 0.0100
G 0.005 0.010 0.015 0.0002 0.0004 0.0006
A
B
D
E
D
F
C
G
Embossed Carrier Tape & Reel Specification — 0201 Flipchip
Symbol Millimeters
A0 0.41±0.03
B0 0.70±0.03
D ø 1.50 + 0.10
D1 ø 0.20 ± 0.05
E 1.75±0.10
F 3.50±0.05
K0 0.38±0.03
P0 2.00±0.05
P1 2.00±0.05
P2 4.00±0.10
W 8.00 + 0.30 -0.10
T 0.23±0.02
Ordering Information
Part Number Package Marking Min. Order Qty.
SP1008-01WTG 0201 Flipchip X 10000
Part Numbering System
Part Marking System
x