B&B Electronics WLNN-EK-DP551 - Product Specification - Manual (Page 31)

Airborne DP550 Family Databook B&B Electronics, Inc.
31
11.0 Recommended Footprint
Figure 7 - Recommended PCB Footprint
15.90mm
Ø5.00mm (X4)
Device Standoff Keepout Area
Ø2.30mm (X4)
Board outline
Dimensions: mm
Tolerance: ± 0.15 (unless noted)
29.60mm MAX
40.60mm MAX
2
1
36
35
Hirose DF12(4.0)-36DP-0.5V
21.00mm
32.00mm
16.00mm
10.50mm
VIEWED FROM TOP
11.1 Mounting Hole Specification
The mounting hole specification is important. It allows for a tight and reliable
friction-based interference between the host PCB and the DP550 stand-off
hardware.
Nominal Diameter: 2.2mm
Tolerance: +0.15mm/-0.00mm
Host Board Thickness: 0.8mm to 1.6mm
11.2 Alternate Mounting Hardware
B&B does support alternate mounting hardware for the DP550 platform. Please
contact your B&B sales representative for further details.