B&B Electronics WLNN-EK-DP551 - Product Specification - Manual (Page 30)

B&B Electronics, Inc. Airborne WLNN DP550 Family Databook
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10.0 Mechanical Outline
Figure 6 – DP550 Mechanical Outline
Module Connector: DF12B-36DS-0.5V(XX) (Hirose)
Hirose: 0.50mm (.020") Pitch Plug, Surface Mount, Dual Row, Vertical, 4.00mm
Stack Height, 36 Circuits
Board Connector: DF12(4.0)-36DP-0.5V(XX) (Hirose)
Hirose: 0.50mm (.020") Pitch Plug, Surface Mount, Dual Row, Vertical, 4.00mm
Stack Height, 36 Circuits
RF Connector: U.FL
Hirose: Ultra Small Surface Mount Coaxial Connector

The standard mounting hardware for the DP550 device uses a friction fit for retention of the
thru-hole pins to the host board.
To support this configuration, the maximum diameter of the thru-hole pin is 2.8mm. Although
this exceeds the recommended mounting hole size (see section 11.1), the pin diameter is
compliant and will compress to fit the recommended hole diameter.