beautypg.com

Applications information – Rainbow Electronics MAX1844 User Manual

Page 19

background image

pation limits often limits how small the MOSFET can be.
Again, the optimum occurs when the switching (AC)
losses equal the conduction (R

DS(ON)

) losses. High-side

switching losses do not usually become an issue until
the input is greater than approximately 15V.

Switching losses in the high-side MOSFET can become
an insidious heat problem when maximum AC adapter
voltages are applied, due to the squared term in the
CV

2

f switching loss equation. If the high-side MOSFET

chosen for adequate R

DS(ON)

at low battery voltages

becomes extraordinarily hot when subjected to
V

IN(MAX)

, reconsider the choice of MOSFET.

Calculating the power dissipation in Q1 due to switching
losses is difficult, since it must allow for difficult-to-quanti-
fy factors that influence the turn-on and turn-off times.
These factors include the internal gate resistance, gate
charge, threshold voltage, source inductance, and PC
board layout characteristics. The following switching loss
calculation provides only a very rough estimate and is no
substitute for breadboard evaluation, preferably including
a sanity check using a thermocouple mounted on Q1.

where C

RSS

is the reverse transfer capacitance of Q1,

and I

GATE

is the peak gate-drive source/sink current (1A

typ).

For the low-side MOSFET, Q2, the worst-case power dis-
sipation always occurs at maximum battery voltage:

PD(Q2) = (1 - V

OUT

/ V

IN(MAX)

)

I

LOAD2

R

DS(ON)

The absolute worst case for MOSFET power dissipation
occurs under heavy overloads that are greater than
I

LOAD(MAX)

but are not quite high enough to exceed the

current limit. To protect against this possibility, you must
“overdesign” the circuit to tolerate I

LOAD

= I

LIMIT(HIGH)

+

[(LIR / 2)

I

LOAD(MAX)

], where I

LIMIT(HIGH)

is the maxi-

mum valley current allowed by the current-limit circuit,
including threshold tolerance and sense-resistance vari-
ation. If short-circuit protection without overload protec-
tion is adequate, enable undervoltage protection, and
use I

LOAD(MAX

) to calculate component stresses.

Choose a Schottky diode D1 having a forward voltage
drop low enough to prevent the Q2 MOSFET body diode
from turning on during the dead time. As a general rule,
a diode having a DC current rating equal to 1/3 of the
load current is sufficient. This diode is optional, and if
efficiency isn’t critical it can be removed.

Applications Information

Dropout Performance

The output voltage adjust range for continuous-conduc-
tion operation is restricted by the nonadjustable 500ns
(max) minimum off-time one-shot. For best dropout per-
formance, use the slower (200kHz) on-time settings.
When working with low input voltages, the duty-factor
limit must be calculated using worst-case values for on-
and off-times. Manufacturing tolerances and internal
propagation delays introduce an error to the TON K-
factor. This error is greater at higher frequencies (Table
5). Also, keep in mind that transient response perfor-
mance of buck regulators operated close to dropout is
poor, and bulk output capacitance must often be
added (see the V

SAG

equation in the Transient

Response section).

The absolute point of dropout is when the inductor cur-
rent ramps down during the minimum off-time (

I

DOWN

)

as much as it ramps up during the on-time (

I

UP

). The

ratio h =

I

UP

/

I

DOWN

indicates the circuit’s ability to

slew the inductor current higher in response to
increased load, and must always be greater than 1. As
h approaches 1, the absolute minimum dropout point,
the inductor current will be less able to increase during
each switching cycle, and V

SAG

will greatly increase

unless additional output capacitance is used.

A reasonable minimum value for h is 1.5, but this may
be adjusted up or down to allow trade-offs between
V

SAG

, output capacitance, and minimum operating

voltage. For a given value of h, the minimum operating
voltage can be calculated as:

where V

DROP1

and V

DROP2

are the parasitic voltage

drops in the discharge and charge paths, t

OFF(MIN)

is

from the Electrical Characteristics table, and K is taken-
from Table 5. The absolute minimum input voltage is cal-
culated with h = 1.

If the calculated V

IN(MIN)

is greater than the required

minimum input voltage, then operating frequency must
be reduced or output capacitance added to obtain an
acceptable V

SAG

. If operation near dropout is anticipat-

ed, calculate V

SAG

to be sure of adequate transient

response.

V

V

V

t

h

K

V

V

IN MIN

OUT

DROP

OFF MIN

DROP

DROP

(

)

(

)

=

+

(

)

×





+

1

2

1

1-

-

PD(Q1 switching)

C

V

f

I

I

RSS

IN(MAX)

2

LOAD

GATE

=

Ч

Ч Ч

MAX1844

High-Speed Step-Down Controller with

Accurate Current Limit for Notebook Computers

______________________________________________________________________________________

19