Ds1374 i, Handling, pc board layout, and assembly, Chip information – Rainbow Electronics DS1374 User Manual
Page 15: Thermal information, Package information, Pin configurations
Handling, PC Board Layout, and
Assembly
The DS1374C package contains a quartz tuning-fork
crystal. Pick-and-place equipment can be used, but
precautions should be taken to ensure that excessive
shocks are avoided. Ultrasonic cleaning should be
avoided to prevent damage to the crystal.
Avoid running signal traces under the package, unless
a ground plane is placed between the package and
the signal line. All no connect (N.C.) pins must be con-
nected to ground.
The SO package can be reflowed as long as the peak
temperature does not exceed 240°C. Peak reflow tem-
perature (
≥ 230°C) duration should not exceed 10 sec-
onds, and the total time above 200°C should not
exceed 40 seconds (30 seconds nominal). Exposure to
reflow is limited to 2 times maximum.
Moisture-sensitive packages are shipped from the fac-
tory dry-packed. Handling instructions listed on the
package label must be followed to prevent damage
during reflow. Refer to the IPC/JEDEC J-STD-020B stan-
dard for moisture-sensitive device (MSD) classifications.
Chip Information
TRANSISTOR COUNT: 11,036
PROCESS: CMOS
SUBSTRATE CONNECTED TO GROUND
Thermal Information
Theta-JA: 221°C/W (µSOP)
Theta-JC: 39°C/W (µSOP)
Theta-JA: 73°C/W (16 SO)
Theta-JC: 23°C/W (16 SO)
DS1374
I
2
C, 32-Bit Binary Counter Watchdog RTC with
Tickle Charger and Reset Input/Output
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 15
© 2004 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
is a registered trademark of Dallas Semiconductor Corporation.
Package Information
(For the latest package outline information, go to
www.maxim-ic.com/DallasPackInfo.)
1
2
3
4
5
10
9
8
7
6
V
CC
SQW
INT
SCL
RST
V
BACKUP
X2
X1
TOP VIEW
SDA
GND
DS1374
µSOP
SCL
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SDA
GND
V
BACKUP
INT
V
CC
SQW
N.C.
N.C.
N.C.
N.C.
RST
N.C.
N.C.
N.C.
N.C.
SO (0.300")
DS1374C
Pin Configurations