Board to board connector, 1 stacking height, 2 hirose connector general specification – Rainbow Electronics DAB-WLS-C21 (BlueTooth) User Manual
Page 24: Stacking height tion, Hirose connector general specifica

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DSH_BTM402_0v9 BISM2 PA Data Sheet.DOC
© 2007 EZURiO Ltd
24
11. Board to Board Connector
This chapter provides specifications for the 40-pin board-to-board connector which serves as physical
interface to the host application. The receptacle assembled on the Module is Hirose type DF12C.
Details are available at: http://www.hirose.co.jp/cataloge_hp/e53700036.pdf
11.1
Stacking Height
tion
Mating headers from Hirose are available in different stacking heights, allowing the spacing between
the BISM II PA and carrier pcb to be changed from 3.5mm to 5.0mm.
Item
Part number
Stacking height
HRS number
Receptacle on
Module
DF12C-40DS-0.5V(86)
3.5 mm – 5 mm
CL537-0007-7-86
Headers DF12 series DF12(3.5)-40DP-0.5V(86)
3.5 mm
CL537-0032-4-86
DF12(4.0)-40DP-0.5V(86)
4.0 mm
CL537-0057-5-86
DF12(5.0)-40DP-0.5V(86)
5.0 mm
CL537-0157-0-86
Notes: The headers listed above are with boss and metal fitting.
Suffix -86 denotes RoHS compliance.
11.2
Hirose Connector general specifica
Parameter
Specification (40 pin Board to Board connector)
Number of Contacts
40
Quantity delivered
2000 Connectors per Tape & Reel
Voltage
50V
Current Rating
0.5A max per contact
Resistance
0.05 Ohm per contact
Dielectric Withstanding Voltage
500V RMS min
Operating Temperature
-45°C...+125°C
Contact Material
phosphor bronze (surface: gold plated)