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Board to board connector, 1 stacking height, 2 hirose connector general specification – Rainbow Electronics DAB-WLS-C21 (BlueTooth) User Manual

Page 24: Stacking height tion, Hirose connector general specifica

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DSH_BTM402_0v9 BISM2 PA Data Sheet.DOC

© 2007 EZURiO Ltd

24

11. Board to Board Connector

This chapter provides specifications for the 40-pin board-to-board connector which serves as physical

interface to the host application. The receptacle assembled on the Module is Hirose type DF12C.

Details are available at: http://www.hirose.co.jp/cataloge_hp/e53700036.pdf

11.1

Stacking Height

tion

Mating headers from Hirose are available in different stacking heights, allowing the spacing between

the BISM II PA and carrier pcb to be changed from 3.5mm to 5.0mm.

Item

Part number

Stacking height

HRS number

Receptacle on

Module

DF12C-40DS-0.5V(86)

3.5 mm – 5 mm

CL537-0007-7-86

Headers DF12 series DF12(3.5)-40DP-0.5V(86)

3.5 mm

CL537-0032-4-86

DF12(4.0)-40DP-0.5V(86)

4.0 mm

CL537-0057-5-86

DF12(5.0)-40DP-0.5V(86)

5.0 mm

CL537-0157-0-86

Notes: The headers listed above are with boss and metal fitting.

Suffix -86 denotes RoHS compliance.

11.2

Hirose Connector general specifica

Parameter

Specification (40 pin Board to Board connector)

Number of Contacts

40

Quantity delivered

2000 Connectors per Tape & Reel

Voltage

50V

Current Rating

0.5A max per contact

Resistance

0.05 Ohm per contact

Dielectric Withstanding Voltage

500V RMS min

Operating Temperature

-45°C...+125°C

Contact Material

phosphor bronze (surface: gold plated)