Max9877 – Rainbow Electronics MAX9877 User Manual
Page 29
MAX9877
WLP Applications Information
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reliability
testing results, refer to the
Application Note: UCSP—A
Wafer-Level Chip-Scale Package
on Maxim’s website
at www.maxim-ic.com/ucsp. See Figure 15 for the rec-
ommended PCB footprint for the MAX9877.
Low RF Susceptibility, Mono Audio
Subsystem with DirectDrive Headphone Amplifier
______________________________________________________________________________________
29
250μm
45
±5μm
Figure 15. PCB Footprint Recommendation Diagram