Philips TDA5051A - Manual (Page 25)

TDA5051A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 13 January 2011 25 of 29
NXP Semiconductors
TDA5051A
Home automation modem
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Abbreviations
MSL: Moisture Sensitivity Level
Fig 25. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 11. Abbreviations
Acronym Description
ADC Analog-to-Digital Converter
AGC Automatic Gain Control
ASK Amplitude Shift Keying
CMOS Complementary Metal-Oxide Semiconductor
DAC Digital-to-Analog Converter
HF High-Frequency
I/O Input/Output
IC Integrated Circuit
LC inductor-capacitor filter
NRZ Non-Return-to-Zero
RMS Root Mean Squared
ROM Read-Only Memory
THD Total Harmonic Distortion
TTL Transistor-Transistor Logic