Package outline, Tda5051a, Nxp semiconductors – Philips TDA5051A User Manual
Page 22: Home automation modem
TDA5051A
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 13 January 2011
22 of 29
NXP Semiconductors
TDA5051A
Home automation modem
14. Package outline
Fig 24. Package outline SOT162-1 (SO16)
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT162-1
8
16
w
M
b
p
D
detail X
Z
e
9
1
y
0.25
075E03
MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.41
0.40
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
0
5
10 mm
scale
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
99-12-27
03-02-19