Microsoft® windows® 7 environment test, Microsoft, Windows – PACKARD BELL TM87 User Manual
Page 198: 7 environment test
188
Appendix B
Microsoft
®
Windows
®
7 Environment Test
Category
Vendor
Description
PN
CPU
Arrandale
2.13G
(Ci3330M)
Intel
IC CP80617004122AG SLBMD C2 2.13G
PGA988
KC.33001.DMP
Arrandale
2.26G
(Ci3350M)
Intel
IC CP80617004161AC SLBPK C2 2.26G
PGA988
KC.35001.DMP
Arrandale
2.26G
(Ci5430M)
Intel
IC CP80617004161AD SLBPN C2 2.26G
PGA988
KC.43001.DMP
Arrandale
2.4G
(Ci5520M)
Intel
IC CP80617004119AE SLBNB C2 2.4G
PGA988P
KC.52001.DMP
Arrandale
2.53G
(Ci5540M)
Intel
IC CP80617004116AD SLBPG C2 2.53G
PGA988
KC.54001.DMP
Arrandale
2.66G
(Ci7620M)
Intel
IC CP80617003981AH SLBPD C2 2.66G PGA
988P
KC.62001.DMP
Q3GG C2
2.13G
Intel
CPU Intel Core i3 330M PGA 2.13G 35W
Arrandale, TJ90, VT, 3M L3
KC.33001.DMP
Q3LN C2
2.26G
Intel
CPU Intel Core i3 350M PGA 2.26G 35W
Arrandale, TJ90, VT, 3M L3
KC.35001.DMP
Q3LR C2
2.26G
Intel
CPU Intel Core i5 430M PGA 2.26G ARD, uP to
SC 2.53G, 3M L3
KC.43001.DMP
RAM SODIMM DDR3-1G 1066
1G DDR3-
1066
SAMSUNG
DDR3 MODU SAM M471B2873EH1-CF8 1GB/
1066
KN.1GB0B.028
1G DDR3-
1066
ELDIPA
DDR3 MODU SAM EBJ11UE6BDS0-AE-F 1GB/
1066
KN.1GB09.012
1G DDR3-
1066
HYNIX
DDR3 MODU HYN HMT112S6BFR6C-G7N0
1G/1066
KN.1GB0G.025
RAM SODIMM DDR3-2G 1066
2G DDR3-
1066
MICRON
MT16JSF25664HZ-1G1F1
KN.2GB04.015
2G DDR3-
1066
SAMSUNG
DDR3 MODU SAM M471B5673EH1-CF8 2G/
1066
KN.2GB0B.012
2G DDR3-
1066
ELDIPA
DDR3 MODU ELP EBJ21UE8BDS0-AE-F 2G/
1066
KN.2GB09.006
2G DDR3-
1066
HYNIX
DDR3 MODU HYN HMT125S6BFR8C-G7N0
2G/1066
KN.2GB0G.014
RAM SODIMM DDR3-4G 1066
4G DDR3-
1066
SAMSUNG
M471B5273BH1-CF8
KN.4GB0B.007
4G DDR3-
1066
ELPIDA
Memory NONE SO-DIMM DDRIII 1066 4GB
dummy P/N LF
KN.4GB00.001
RAM SODIMM DDR3-1G 1333