Habey BIS-6590 - Manual (Page 7)

Chassis
Color Black
Dimension 280mm× 219.2mm× 115 mm(W×D×H)
Structure “ICEFIN” Enclosure
Material Aluminum+ Fine Quality Galvanized Steel Sheet
Mother-
board
Model No. BPC-7937
CPU
Intel LGA1155 Sandy Bridge/Ivy Bridge Core i3/i5
and Celeron CPUs
Chipset Intel H61/Q77/B75
Memory
2x DDR3 DIMM slots support dual channel DDR3
1066/1333/1600 MHzRAM up to 16GB. Non-ECC
Storage
CF N/A
SSD 1x Mini PCIe SSD
HDD 1x SATAII/SATAIII HDD
System
Features
LAN
Realtek RTL8111E,10/100/1000Mbps,2x RJ45,
Wake-on-LAN
USB
H61 Chipset: 6x USB2.0; Q77 Chipset : 4x USB
2.0, 2x USB 3.0
COM
2x COM. COM1/COM2 support RS232(DB9),
COM2 also supports RS422/485
Display
1x VGA (DB15), 1x DVI-D; VGA + DVI dual inde-
pendent display
Cooling Sys. Fanless, “ICEFIN” thermal design
Audio ALC892, 5.1CH ,1x Mic-in, 1x Line-in, 1x Line-out
Expansion
1x Mini PCIe supports Mini PCIe SSD. Inbuilt SIM
slot for 3G Module. 2x PCI ( optional 1x PCI & 1x
PCIE X4) can be extended by Expansion slot
LED Power LED, HDD LED
System Control Power Switch
PS/2
Reserved 2x 4Pin supports PS/2 keyboard and
mouse
WLAN 1x 3G/WiFi SMA antenna (optional)
GPIO 8 bit GPIO
Power
Power Supply
DC +12V power adapter (Recommend to utilize
high-power adapter if the power of CPU is over
65W)
Reliability
Installation Desktop or Wallmounted
Operating Temp 0°C - 60°C
Storage Temp -40°C - 85°C
Relative Humidity 5%~95% relative humidity, non-condensing
Operating Vibration 0.5g rms/5~500Hz/random operating
EMC CE/FCC Class B
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