DFI KS210-IMX6 Manual - Manual (Page 7)

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7
Chapter 1 Introduction
Front Panel
Protection
• IP65 (Dust Tight; Water Proof protection)
Construction • Aluminum front bezel, rugged metal housing
Mounting • Wall mount (VESA 75x75)
• Panel mount (Mounting clamp)
Vibration • Sweep frequency: 10~500~10 Hz/1min
• Amplitude: 0.75mm
• IEC 68-2-64 compliant
Shock • Operating: 3G peak acceleration (11 m sec. duration)
• Non-operating: 10G peak acceleration (11 m sec. duration)
• IEC 68-2-64 compliant
Dimensions • 235mm x 150mm x 43.80mm (W x H x D)
Weight • 1.26 kg
OS Support • Android 4.3
Specifications
Processor • Freescale i.MX 6 series processor
- i.MX6L: i.MX 6DualLite at 1.0GHz, two cortex-A9 cores
System Memory • 2GB DDR3 memory down
LCD and Touch
Screen
• 7” (1024x600) WSVGA TFT touch screen LCD
• 400 NITS
• Projected capacitive touch screen
Storage • 1 SD card socket
• Supports 4GB eMMC onboard
Onboard LAN
Features
• One Atheros AR8033 Ethernet PHY
• Supports 10Mbps, 100Mbps and 1Gbps data transmission
Audio • 2 built-in 1W speakers (left and right sides)
I/O Ports • Bottom
- 1 DB-9 RS232 serial port
- 1 HDMI port
- 1 USB Client port (Type Mini B)
- 2 USB 2.0/1.1 ports (Type A)
- 1 Line-out/Mic-in jack
- 1 2-pole terminal block DC-in
- 1 LAN port
- 8-bit GPIO 7-pole terminal block (4-bit in/ 4-bit out)
- 1 Power switch
• Side
- 2 built-in 1W speakers (left and right sides)
• Top
- 1 SD card socket
- 1 DB-9 RS232/422/485 serial port
Power • Power input voltage: 12~36V DC-in
Expansion
Slots
• 1 Mini PCIe slot
- Supports PCIe and USB signals
- Supports full size Mini PCIe card
• 1 mSATA slot (Mini PCIe type)
• 1 SIM card socket
- Reserved for 3G/LTE module
Environment • Temperature
- Operating: 0 o C ~ 60 o C
- Storage: -30 o C ~ 80 o C
• Relative Humidity
- 85% RH at 65 o C
Chapter 1