Package dimensions in mm, Assembly instructions, Tsop62 – Vishay TSOP62 User Manual
Page 6: Vishay
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6
Document Number 82177
Rev. 3, 23-Jun-03
VISHAY
TSOP62..
Vishay Semiconductors
Package Dimensions in mm
Assembly Instructions
Reflow Soldering
• Reflow soldering must be done within 72 hours
stored under max. 30 °C, 60 % RH after opening
envelop
• Recommended soldering paste (composition: SN 63
%, Pb 37 %) Melting temperature 178 °C to 192 °C
• Apply solder paste to the specified soldering pads,
by using a dispenser or by screen printing.
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