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Pin definitions – Cypress CY7C1334H User Manual

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CY7C1334H

Document #: 38-05678 Rev. *B

Page 3 of 13

Pin Definitions

Name

I/O

Description

A0, A1, A

Input-

Synchronous

Address Inputs used to select one of the 64K address locations. Sampled at the rising edge
of the CLK. A

[1:0]

are fed to the two-bit burst counter.

BW

[A:D]

Input-

Synchronous

Byte Write Inputs, active LOW. Qualified with WE to conduct writes to the SRAM. Sampled
on the rising edge of CLK.

WE

Input-

Synchronous

Write Enable Input, active LOW. Sampled on the rising edge of CLK if CEN is active LOW.
This signal must be asserted LOW to initiate a Write sequence.

ADV/LD

Input-

Synchronous

Advance/Load Input. Used to advance the on-chip address counter or load a new address.
When HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a
new address can be loaded into the device for an access. After being deselected, ADV/LD
should be driven LOW in order to load a new address.

CLK

Input-Clock

Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN.
CLK is only recognized if CEN is active LOW.

CE

1

Input-

Synchronous

Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE

2

and CE

3

to select/deselect the device.

CE

2

Input-

Synchronous

Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction
with CE

1

and CE

3

to select/deselect the device.

CE

3

Input-

Synchronous

Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE

1

and

CE

2

to select/deselect the device.

OE

Input-

Asynchronous

Output Enable, asynchronous input, active LOW. Combined with the synchronous logic
block inside the device to control the direction of the I/O pins. When LOW, the I/O pins are
allowed to behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input
data pins. OE is masked during the data portion of a write sequence, during the first clock when
emerging from a deselected state, when the device has been deselected.

CEN

Input-

Synchronous

Clock Enable Input, active LOW. When asserted LOW the Clock signal is recognized by the
SRAM. When deasserted HIGH the Clock signal is masked. Since deasserting CEN does not
deselect the device, CEN can be used to extend the previous cycle when required.

ZZ

Input-

Asynchronous

ZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep”
condition with data integrity preserved. During normal operation, this pin can be connected to
V

SS

or left floating.

DQs

I/O-

Synchronous

Bidirectional Data I/O Lines. As inputs, they feed into an on-chip data register that is triggered
by the rising edge of CLK. As outputs, they deliver the data contained in the memory location
specified by A

[16:0]

during the clock rise of the read cycle. The direction of the pins is controlled

by OE and the internal control logic. When OE is asserted LOW, the pins can behave as outputs.
When HIGH, DQ

s

are placed in a tri-state condition. The outputs are automatically tri-stated

during the data portion of a write sequence, during the first clock when emerging from a
deselected state, and when the device is deselected, regardless of the state of OE.

MODE

Input

Strap pin

Mode Input. Selects the burst order of the device.
When tied to Gnd selects linear burst sequence. When tied to V

DD

or left floating selects inter-

leaved burst sequence.

V

DD

Power Supply

Power supply inputs to the core of the device.

V

DDQ

I/O Power

Supply

Power supply for the I/O circuitry.

V

SS

Ground

Ground for the device.

V

SSQ

I/O Ground

Ground for the I/O circuitry. Should be connected to the ground of the system

NC

No Connects. Not internally connected to the die. 4M, 9M,18M, 72M, 144M, 288M, 576M and
1G are address expansion pins and are not internally connected to the die.

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