beautypg.com

Capacitance[6, Thermal resistance[6, Ac test loads and waveforms – Cypress CY7C1041DV33 User Manual

Page 4: Capacitance, Thermal resistance

background image

CY7C1041DV33

Document #: 38-05473 Rev. *E

Page 4 of 13

Capacitance

[6]

Parameter

Description

Test Conditions

Max

Unit

C

IN

Input Capacitance

T

A

= 25

°C, f = 1 MHz, V

CC

= 3.3V

8

pF

C

OUT

IO Capacitance

8

pF

Thermal Resistance

[6]

Parameter

Description

Test Conditions

FBGA

Package

SOJ

Package

TSOP II

Package

Unit

Θ

JA

Thermal Resistance (Junction
to Ambient)

Still Air, soldered on a 3 × 4.5 inch,
four layer printed circuit board

27.89

57.91

50.66

°C/W

Θ

JC

Thermal Resistance (Junction
to Case)

14.74

36.73

17.17

°C/W

AC Test Loads and Waveforms

The AC test loads and waveform diagram follows.

[7]

90%

10%

3.0V

GND

90%

10%

ALL INPUT PULSES

* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT

Rise Time: 1 V/ns

Fall Time: 1 V/ns

30 pF*

OUTPUT

Z = 50

Ω

50

Ω

1.5V

(b)

(a)

3.3V

OUTPUT

5 pF

(c)

R 317

Ω

R2

351

Ω

High-Z Characteristics

10 ns device

Notes

6. Tested initially and after any design or process changes that may affect these parameters.
7. AC characteristics (except High-Z) are tested using the load conditions shown in

AC Test Loads and Waveforms

(a). High-Z characteristics are tested for all speeds

using the test load shown in (c).

[+] Feedback

[+] Feedback