Capacitance[6, Thermal resistance[6, Ac test loads and waveforms – Cypress CY7C1041DV33 User Manual
Page 4: Capacitance, Thermal resistance

CY7C1041DV33
Document #: 38-05473 Rev. *E
Page 4 of 13
Capacitance
Parameter
Description
Test Conditions
Max
Unit
C
IN
Input Capacitance
T
A
= 25
°C, f = 1 MHz, V
CC
= 3.3V
8
pF
C
OUT
IO Capacitance
8
pF
Thermal Resistance
Parameter
Description
Test Conditions
FBGA
Package
SOJ
Package
TSOP II
Package
Unit
Θ
JA
Thermal Resistance (Junction
to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
four layer printed circuit board
27.89
57.91
50.66
°C/W
Θ
JC
Thermal Resistance (Junction
to Case)
14.74
36.73
17.17
°C/W
AC Test Loads and Waveforms
The AC test loads and waveform diagram follows.
90%
10%
3.0V
GND
90%
10%
ALL INPUT PULSES
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
Rise Time: 1 V/ns
Fall Time: 1 V/ns
30 pF*
OUTPUT
Z = 50
Ω
50
Ω
1.5V
(b)
(a)
3.3V
OUTPUT
5 pF
(c)
R 317
Ω
R2
351
Ω
High-Z Characteristics
10 ns device
Notes
6. Tested initially and after any design or process changes that may affect these parameters.
7. AC characteristics (except High-Z) are tested using the load conditions shown in
(a). High-Z characteristics are tested for all speeds
using the test load shown in (c).