Mounting, bonding, and grounding – Rockwell Automation 1770 Industrial Automation Wiring and Grounding Guidelines User Manual
Page 4
Industrial Automation Wiring and Grounding Guidelines
4
Publication 1770-4.1 – February 1998
Figure 1
Mounting Assembly Details
Category-2
Conductors
Enclosure Wall
12618-I
I/O Block
Transformer
Use greater
spacing without
conduit
Tighter spacing
allowed
with conduit
Tighter spacing allowed
where forced by spacing
of connection points
Place modules to
comply with spacing
guidelines if possible
Category-1
Conductors
(ac Power Lines)
Category-2
Conductors
Conduit
1771 I/O Chassis
Conduit
After establishing all layouts, you can begin mounting, bonding, and
grounding each chassis. Bonding is the connecting together of metal
parts of chassis, assemblies, frames, shields, and enclosures to
reduce the effects of emi and ground noise. Grounding is the
connection to the grounding-electrode system to place equipment at
earth ground potential.
Mounting, Bonding, and
Grounding
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