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Pin qfn (4 mm x 4 mm body) package drawing – Cirrus Logic CS48LV13 User Manual

Page 25

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25

DS1057F1

6 Package Dimensions

7. Controlling dimensions are in millimeters.

8. Dimensioning and tolerancing per ASME Y 14.5M.

9. Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the package body

and the seating plane.

10.Recommended reflow profile is per JEDEC/IPC J-STD-020

.

aaa

Package edge tolerance

0.05

bbb

Wafer flatness

0.1

ccc

Coplanarity

0.03

ddd

Ball/bump offset (package)

0.15

eee

Ball/bump offset (ball)

0.05

1.Basic spacing between centers.

Table 6-2. QFN Package Dimension

MILLIMETERS

INCHES

DIM

MIN

NOM

MAX

MIN

NOM

MAX

A

0.80

0.90

1.00

0.031

0.035

0.039

A1

0.00

0.02

0.05

0.000

0.001

0.002

A3

0.20 REF

0.008 REF

b

0.20

0.25

0.30

0.008

0.010

0.012

D

4.00 BSC

0.157 BSC

D2

2.60

2.70

2.80

0.102

0.106

0.110

e

0.50 BSC

0.020 BSC

E

4.00 BSC

0.157 BSC

E2

2.60

2.70

2.80

0.102

0.106

0.110

L

0.30

0.40

0.50

0.012

0.016

0.020

aaa

0.15

0.006

bbb

0.10

0.004

ddd

0.05

0.002

eee

0.08

0.003

Table 6-1. WLCSP Package Dimension (Cont.)

Symbol

Description

Dimensions

24-PIN QFN (4 mm x 4 mm Body) Package Drawing

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