Pin qfn (4 mm x 4 mm body) package drawing – Cirrus Logic CS48LV13 User Manual
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DS1057F1
6 Package Dimensions
7. Controlling dimensions are in millimeters.
8. Dimensioning and tolerancing per ASME Y 14.5M.
9. Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the package body
and the seating plane.
10.Recommended reflow profile is per JEDEC/IPC J-STD-020
.
aaa
Package edge tolerance
0.05
bbb
Wafer flatness
0.1
ccc
Coplanarity
0.03
ddd
Ball/bump offset (package)
0.15
eee
Ball/bump offset (ball)
0.05
1.Basic spacing between centers.
Table 6-2. QFN Package Dimension
MILLIMETERS
INCHES
DIM
MIN
NOM
MAX
MIN
NOM
MAX
A
0.80
0.90
1.00
0.031
0.035
0.039
A1
0.00
0.02
0.05
0.000
0.001
0.002
A3
0.20 REF
0.008 REF
b
0.20
0.25
0.30
0.008
0.010
0.012
D
4.00 BSC
0.157 BSC
D2
2.60
2.70
2.80
0.102
0.106
0.110
e
0.50 BSC
0.020 BSC
E
4.00 BSC
0.157 BSC
E2
2.60
2.70
2.80
0.102
0.106
0.110
L
0.30
0.40
0.50
0.012
0.016
0.020
aaa
0.15
0.006
bbb
0.10
0.004
ddd
0.05
0.002
eee
0.08
0.003
Table 6-1. WLCSP Package Dimension (Cont.)
Symbol
Description
Dimensions
24-PIN QFN (4 mm x 4 mm Body) Package Drawing