PNI RM3000-F Sensor Suite - Manual (Page 19)

PNI Sensor Corporation Doc #1016102 r04
RM3000-f & RM2000-f Sensor Suite User Manual Page 19
Table 3-6: Recommended Solder Processing Parameters
1
Parameter Symbol Value
Preheat Temperature, Minimum T
Smin
150°C
Preheat Temperature, Maximum T
Smax
200°C
Preheat Time (T
Smin
to T
Smax
) 60 – 180 seconds
Solder Melt Temperature T
L
>218°C
Ramp-Up Rate (T
Smax
to T
L
) 3°C/second maximum
Peak Temperature T
P
<260°C
Time from 25°C to Peak (T
P
) 6 minutes maximum
Time above T
L
t
L
60 – 120 seconds
Soak Time (within 5°C of T
P
) t
P
10 – 20 seconds
Rampdown Rate 4°C/second maximum
Footnote:
1. Meets IPC/JEDEC J-STD-020 profile recommendations. Sen-XY-f and Sen-
Z-f classified as moisture sensitivity level 1. 3D MagIC MLF classified as
moisture sensitivity level 3.