3 package mechanical data – Communication Concepts 2N5192 User Manual
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Package mechanical data
2N5191 2N5192
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3 Package
mechanical
data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at:
www.st.com
See also other documents in the category Communication Concepts Hardware:
- MRFE6VP61K25HR6 Mosfet (13 pages)
- FM-1KW Broadcast Application Note (14 pages)
- 2M 1KW Amateur Application Note (16 pages)
- MRF154 (9 pages)
- EB104 Engineering Bulletin (9 pages)
- EB104 Bias Setting (1 page)
- MRF150 (9 pages)
- MRF151G (9 pages)
- MRF141G (11 pages)
- MRF429 (7 pages)
- AN758 (16 pages)
- MRF422 (6 pages)
- EB27A Construction Hints (8 pages)
- EB27A Engineering Bulletin (5 pages)
- EB63A Construction Hints (9 pages)
- EB63 Engineering Bulletin (7 pages)
- MRF454 (4 pages)
- MRF421 (5 pages)
- AN762 Application Note (10 pages)
- AN762 Construction Hints (8 pages)
- MRF426 (7 pages)
- AN779L (2 pages)
- MRF476 (1 page)
- AN779 Application Note (10 pages)
- FL1 Low Pass Filter (6 pages)
- RF2067 (2 pages)
- RF2061 (2 pages)
- RF400 Specifications (1 page)
- 2N4401 (7 pages)
- 2N5194 (6 pages)
- 2N6488 (6 pages)
- MJE243 (6 pages)
- MPS2222 (6 pages)
- MPSH81 (11 pages)
- MicroDot (1 page)
- SemiRigid Coax (1 page)
- RG-188 (1 page)
- RG-196 (1 page)
- SM250-50 (2 pages)
- TC Coax (1 page)
- UC-141C-25 SEMI-RIGID COAX (1 page)
- 2673000801 (1 page)
- 2673021801 (1 page)
- 2861000202 (1 page)