Diodes AP1117/AP1117I User Manual
Page 4
AP1117/AP1117I
Document number: DS31009 Rev. 23 - 2
4 of 13
June 2013
© Diodes Incorporated
AP1117/AP1117I
Electrical Characteristics
(cont.) (@T
A
= +25°C, unless otherwise specified.)
Parameter Conditions
Min
Typ
Max
Unit
Load Regulation
(cont.)
AP1117-3.3
V
IN
= 5V, 0
≤ I
OUT
≤ 1A,
T
A
= +25°C (Notes 5, 6)
— 26 33 mV
AP1117-5.0
V
IN
= 8V, 0
≤ I
OUT
≤ 1A,
T
A
= +25°C (Notes 5, 6)
— 40 50 mV
Dropout Voltage
(V
IN
-V
OUT
)
AP1117-ADJ/1.5/1.8
2.5/3.3/5.0
I
OUT
= 800mA,
V
OUT
= 1%
V
OUT
0°C
≤ T
J
≤ +125°C
— 1.2 1.3 V
Dropout Voltage
(V
IN
-V
OUT
)
AP1117-ADJ/1.5/1.8
2.5/3.3/5.0
I
OUT
= 1A,
V
OUT
= 1% V
OUT
0°C
≤ T
J
≤ +125°C
— 1.3 1.4 V
AP1117I-ADJ/1.5/1.8
2.5/3.3/5.0
-40°C
≤ T
J
≤ +125°C
Current Limit
AP1117-ADJ/1.5/1.8
2.5/3.3/5.0
(V
IN
-V
OUT
) = 5V
1. 1
—
—
A
Minimum Load Current
(Note 7)
AP1117-XXX
0°C
≤ T
J
≤ +125°C
— 5 10
mA
Thermal Regulation
T
A
= +25°C, 30ms pulse
— 0.008
0.040
%/W
Ripple Rejection
F = 180Hz, C
OUT
= 25µF Tantalum, I
OUT
= 1A
— — — —
AP1117-XXX
V
IN
= V
OUT
+3V
— 60 70 dB
Temperature Stability
I
O
= 10mA
— 0.5 — %
θ
JA
Thermal Resistance
Junction-to-Ambient
θ
JA
SOT89-3: Control Circuitry/Power Transistor (Note 8)
SOT223: Control Circuitry/Power Transistor (Note 9)
TO252: Control Circuitry/Power Transistor (Note 8)
TO220-3: Control Circuitry/Power Transistor (Note 8)
TO263: Control Circuitry/Power Transistor (Note 8)
—
—
—
—
—
164
107
73
78
60
—
—
—
—
—
°C/W
θ
JC
Thermal Resistance
Junction-to-Case
SOT89-3: Control Circuitry/Power Transistor (Note 8)
SOT223: Control Circuitry/Power Transistor (Note 9)
TO252: Control Circuitry/Power Transistor (Note 8)
TO220-3: Control Circuitry/Power Transistor (Note 8)
TO263: Control Circuitry/Power Transistor (Note 8)
—
—
—
—
—
42
15
12
3.5
3.5
—
—
—
—
—
°C/W
Notes:
7. Quiescent current is defined as the minimum output current required in maintaining regulation. At 12V input/output differential the device is guaranteed
to regulate if the output current is greater than 10mA.
8. Test conditions for SOT89-3, TO220-3, TO252 and TO263: Devices mounted on FR-4 substrate, single sided PC board, 2oz copper,with minimum
recommended pad layout, no air flow. The case point of
θ
JC
is located on the thermal tab.
9. Test conditions for SOT223: Devices mounted on FR-4 substrate, single sided PC board, 2oz copper, with 5mm x 5mm thermal pad layout, no air flow.
The case point of
θ
JC
is located on the thermal tab.