Q-tech, Qcc325 series, Reflow profile – Q-Tech QCC325 User Manual
Page 3: Embossed tape and reel information, Environmental and mechanical specifications, Reel size (diameter in mm) qty per reel (pcs)
3
Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-tech.com
QCC325 SERIES
LOW PROFILE 5 x 3.2mm MINIATURE SMD CRYSTAL OSCILLATORS
1.8 to 5.0Vdc - 1MHz to 220.000MHz
QCC325 (Revision F, August 2010) (ECO# 9911)
Q-TECH
CORPORATION
Vdd
GND
0.1xVdd
0.9xVdd
VOH
VOL
Tr
Tf
TH
T
0.5xVdd
SYMMETRY = x 100%
TH
T
Output Waveform (Typical)
Frequency vs. Temperature Curve
Test Circuit
The Tristate function on pin 1 has a built-in pull-up resistor so it can be left
floating or tied to Vdd without deteriorating the electrical performance.
Reflow Profile
0
20
40
60
80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420
Time (s)
25
50
75
100
125
150
175
200
225
250
TEMP(*C)
0
60s min.
120s max.
60s min.
120s max.
225º min.
240º max.
60s min.
150s max.
240º
Ramp down (6ºC/s Max)
Ramp up (3ºC/s Max)
TYPICAL REFLOW PROFILE FOR Sn-Pb ASSEMBLY
Embossed Tape and Reel Information
Dimensions are in mm. Tape is compliant to EIA-481-A.
FEEDING (PULL) DIRECTION
ø13.0±0.5
2.5
1.4±0.1
5º MAX
ш1.5
2.0
1.75±0.1
0.3±.005
ш1.5
2.0±0.1
5.5±0.1
3.5±0.1
4.0±0.1
ш80±1
ш178±1
17.5
12.0±0.3
8±0.1
5.4
±0.1
120º
Reel size (Diameter in mm)
Qty per reel (pcs)
178
1,000
-
-
Output
Ground
4
3
2
0.1µF
15pF
1
Tristate Function
Power
supply
10k
mA
Vdc
+
+
+
(*)
or
0.01µF
QCC325
(*) CL includes probe and jig capacitance
Typical test circuit for CMOS logic
Environmental and Mechanical Specifications
FREQUENCY VS. TEMPERATURE QCC325L15 20MHz
-6
-5
-4
-3
-2
-1
0
1
2
3
4
-40
-25
-10
5
15
25
40
55
70
85
Temp (°C)
p
p
m
Environmental Test
Test Conditions
Temperature cycling
MIL-STD-883, Method 1010, Cond. B
Constant acceleration
MIL-STD-883, Method 2001, Cond. A, Y1
Seal: Fine and Gross Leak
MIL-STD-883, Method 1014, Cond. A and C
Vibration sinusoidal
MIL-STD-202, Method 204, Cond. D
Shock, non operating
MIL-STD-202, Method 213, Cond. I
Resistance to solder heat
MIL-STD-202, Method 210, Cond. B
Resistance to solvents
MIL-STD-202, Method 215
Solderability
MIL-STD-202, Method 208
ESD Classification
MIL-STD-883, Method 3015, Class 1 HBM 0 to 1,999V
Moisture Sensitivity Level
J-STD-020, MSL=1