OSRAM VALUE Flex Advanced - Manual (Page 2)

2 3
VF06A
VF06P
1 2
3b 3a
5 4
Care must be taken to provide a clean and
even mounting surface, which assures,
that the allowed operating temperatures
(~300°C/≤4s) are not exceeded.
Soldering of wires with the module mounted
on a thermally conducted surface:
• Pretin solderpads and wires
and solder for max 3s at 350°C.
• Allow solderpoints to completely
cool down before the next soldering.
• Prevent shear- or peel forces.
When mounting on metallic or otherwise
conductive surfaces, there needs to be an
electrical isolation at soldering points be-
tween module and the mounting surface. The mounting of the module is facilitated
by means of the double-sided adhesive
on the back-surface of the module. Care
must be taken to provide a clean and dry
mounting surface, free of oils or silicone coatings as
well as dirt particle. The mounting substrate must have
suffi cient structural integrity. Take care to completely
remove the protective backing.
焊接需在干净平坦的操作面上进行，并且确保
不会超过所允许的操作温度(~300°C/≤4s)。
通过模组背面的双面胶将有助于产品安装。注意安装面需清
洁、干燥、无油脂或树脂涂层以及不净颗粒物。安装基底必
须要有足够的结构完整性。请小心完整地移除保护胶条。
焊接模块连接线时需在导热较好的表面上进行
• 连线和焊盘上需做预上锡处理，焊接过程中在
350°C焊接温度下最多停留3秒钟。
• 需待焊点完全冷却后再进行后续焊接
• 注意剪切或剥离力度，以免造成模块损伤
当安装在金属或其他导电表面时，在焊点及安
装面之间需要做电子绝缘处理。
#11709
black
148 x 210 mm
#11709
black
148 x 210 mm
G10447913_LINEARlight_Flex_Value_VF06A_VF06P_03.indd 2-3 G10447913_LINEARlight_Flex_Value_VF06A_VF06P_03.indd 2-3 11.03.13 11:06 11.03.13 11:06