Littelfuse 250S Series - Manual (Page 3)

59
Revised: July 29, 2012
POLY-FUSE ® Resettable PTCs
© 2012 Littelfuse, Inc
250S S
eries
Surface Mount > 250S Series
250S Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/250S.html for current information.
Soldering Parameters
1SPmMF'FBUVSF 1C'SFF"TTFNCMZ
"WFSBHF3BNQ6Q3BUF 5
S(max)
to T
P
) 3°C/second max
Pre Heat:
Temperature Min (T
s(min)
) 150°C
Temperature Max (T
s(max)
) 200°C
Time (Min to Max) (t
s
) 60 – 180 secs
Time Maintained
Above: Temperature (T
-
) 217°C
Temperature (t
-
) 60 – 150 seconds
Peak / Classification Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
-- All temperature refer to topside of the package, measured on the package body surface
-- If reflow temperature exceeds the recommended profile, devices may not meet the
performance requirements
3FDPNNFOEFESFnPXNFUIPET*3
WBQPSQIBTFPWFO
IPUBJSPWFO
/
2
environment
for lead
-- Recommended maximum paste thickness is 0.25mm (0.010 inch)
-- Devices can be cleaned using standard industry methods and solvents
-- Devices can be reworked using the standard industry practices
Environmental Specifications
Operating/Storage
Temperature
-40°C to +85°C
Maximum Device Surface
Temperature in Tripped State
125°C -/+10ºC
Passive Aging +85°C, 1000 hours
Humidity Aging +85°C, 85%,R.H.,1000 hours
Thermal Shock
.*-o45%o'
.FUIPE(
+125°C to -55°C 10 times
Solvent Resistance .*-o45%o
.FUIPE'
Moisture Sensitivity Level -FWFM
+o45%o$
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Lead Solderability
.FFUT&*"4QFDJmDBUJPO34&
"/4*
J-STD-002 Category 3.