beautypg.com

Surface mount fuses, Thin film > 1206 size > slo-blo, 468 series – Littelfuse 468 Series User Manual

Page 2: Soldering parameters

background image

© 2013 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 12/19/13

Surface Mount Fuses

Thin Film > 1206 Size > Slo-Blo

®

> 468 Series

Average Time Current Curves

Temperature Rerating Curve

Reflow Condition

Pb – Free assembly

pre Heat

- Temperature min (T

s(min)

)

150°C

- Temperature max (T

s(max)

)

200°C

- Time (min to max) (t

s

)

60 – 180 secs

Average ramp up rate (liquidus Temp
(T

l

) to peak

5°C/second max

T

S(max)

to T

l

- Ramp-up Rate

5°C/second max

Reflow

- Temperature (T

l

) (liquidus)

217°C

- Temperature (t

l

)

60 – 150 seconds

peak Temperature (T

p

)

260

+0/- 5

°C

Time within 5°C of actual peak
Temperature (t

p

)

20 – 40 seconds

Ramp-down Rate

5°C/second max

Time 25°C to peak Temperature (T

p

)

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

Wave Soldering

260°C, 10 seconds max.

Note:
1. Derating depicted in this curve is in addition to the standard derating of 25% for

continuous operation.

Example:
For continuous operation at 70 degrees celsius, the fuse should be deratedas follows:
I = (0.75)(0.80)I

RAT

= (0.60)I

RAT

2. The temperature derating curve represents the nominal conditions. For questions

about temperature derating curve, please consult Littelfuse technical support
for assistance.

Time

Te

mperatur

e

T

P

T

L

T

S(max)

T

S(min)

25

t

P

t

L

t

S

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

T

L

to T

P

0.001

0.01

0.1

1

10

100

0

0

1

0

1

1

0

Current in Amperes

Ti

me

in Seconds

3A

2A 2.

5A

1A

1.

5A

.5

A