Introduction to circuit protection, Universal modular fuses, Transientology – Littelfuse 804 Series User Manual
Page 2: Te > time lag > 804 series, Wave parameter lead-free recommendation preheat, Temperature minimum: 100, Ctemperature maximum: 150, C maximum solder dwell time: 2-5 seconds
Introduction to Circuit Protection
Introduction to Circuit Protection
Transientology
2
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/804.html for current information.
TE-UMF 804 Series
Universal Modular Fuses
TE > Time Lag > 804 Series
Average Time Current Curves
Temperature Rerating Curve
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
4
0
50
60
70
80
90
100
110
120
130
1
4
0
150
160
170
180
190
200
210
220
230
2
4
0
Time (Seconds)
T
emperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter
Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
5ZQJDBM*OEVTUSZ3FDPNNFOEBUJPO
Temperature Minimum:
100
°
C
Temperature Maximum:
150
°
C
Preheat Time:
60-180 seconds
Solder Pot Temperature:
260
°
C Maximum
Solder Dwell Time:
2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
)FBUJOH5JNFTFDPOETNBY
Note: These devices are not recommended for IR or
Convection Reflow process.
Recommended Process Parameters:
0%
20%
40%
60%
80%
100%
120%
140%
-55 -30 -5 20 45 70 95 120
AMBIENT TEMPERATURE (°C)
P
E
RCE
NT
O
F
RAT
ING
804 DE-RATING CURVE
CURRENT [A]
Blo
wtime [sec].
0.1
1
10
100
1000
0.8A
1A
1.25A
1.6A
2A
2.5A
3.15A
4A
5A
6.3A
0.010
0.001
0.100
1.000
10.000
100.000
1000.000