Littelfuse SL1122 Series - Manual (Page 3)

Gas Discharge Tube (GDT) Products
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/08/14
SL1122A Series
Reflow Condition Pb-free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (Min to Max) (t
s
) 60 – 180 seconds
Average Ramp-up Rate (Liquidus Temp
(T
L
) to peak)
3°C/second max.
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max.
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of Actual Peak
Temperature (t
p
)
10 – 30 seconds
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature (T
P
) 8 minutes max.
Do not exceed 260°C
Soldering Parameters - Reflow Soldering
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T
L
to T
P
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0 10 20 30 40 50 60 70 80 90 10
0
11
0
12
0
13
0
14
0
15
0
16
0
17
0
18
0
19
0
20
0
21
0
22
0
23
0
24
0
Time (Seconds)
Temperature (°C) - Measured on bottom side
of boar
d
Cooling Time Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature) (Typical Industry Recommendation)
Temperature Minimum: 100 ° C
Temperature Maximum: 150 ° C
Preheat Time: 60-180 seconds
Solder Pot Temperature: 280 ° C Maximum
Solder Dwell Time: 2-5 seconds
Recommended Process Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
* Devices that are soldered require inspection before use.