Littelfuse 452 Series - Manual (Page 2)

© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/17/14
Surface Mount Fuses
NANO 2® > Slo-Blo ® > 452/454 Series
Average Time Current Curves
Reflow Condition Pb – Free assembly
pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (Min to Max) (t
s
) 60 – 120 secs
Average ramp up rate (liquidus Temp
(T
l
) to peak
5°C/second max.
T
S(max)
to T
l
- Ramp-up Rate 5°C/second max.
Reflow
- Temperature (T
l
) (liquidus) 217°C
- Temperature (t
l
) 60 – 90 seconds
peak Temperature (T
p
) 260 +0/–5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 5°C/second max.
Time 25°C to peak Temperature (T
p
) 8 minutes max.
Do not exceed 260°C
Wave Soldering parameters
260°C Peak
Temperature,
3 seconds max.
Soldering Parameters
Temperature Rerating Curve
Note:
1. Derating depicted in this curve is in addition to the standard derating of 25% for
continuous operation.
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T L to T P
0.01
0.1
1
10
100
0.1 1 10 100 1000
TIME IN SECONDS
CURRENT IN AMPS
375mA 500mA
1.00A 1.50A 2.00A 2.50A 3.00A 3.50A 4.00A 5.00A 7.00A
750mA
8.00A 12.0A