beautypg.com

Surface mount fuses, Flat-pak, Slo-blo – Littelfuse 203 Series User Manual

Page 2: Fuse > 203 series, Dimensions average time current curves, Soldering parameters temperature rerating curve, Product characteristics part numbering system, Packaging

background image

© 2013 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 12/19/13

Surface Mount Fuses

FLAT-PAK

®

Slo-Blo

®

Fuse > 203 Series

9.45

(.372")

6.35

(.250")

4.19

(.165")

0.53

(.021")

10.16

(.400")

.135"

0.30(.012")

6

o

203 FLAT- PAK

LF

T 2A

250 V

PAT 4563666

DIP Configuration

(Thru-Hole) Mounting

9.45

(.372")

6.35

(.250")

4.19

(.165")

203G FLAT- PAK

LF

T 2A

250 V

PAT 4563666

SMF Configuration

("Gull Wing" Surface Mount)

1.52

(.060")

0.08 (.003")

1.40 (.055")

15.24 (.600")

17.12(.674)

4.06(.160)

11.53(.454)

2.79 (.110)

Recommended Pad Layout

9.45

(.372")

6.35

(.250")

4.19

(.165")

0.53

(.021")

10.16

(.400")

.135"

0.30 (.012")

6

o

202 FLAT- PAK

LF

F 2A

250 V

PAT 4563666

DIP Configuration

(Thru-Hole) Mounting

9.45

(.372")

6.35

(.250")

4.19

(.165")

202G FLAT- PAK

LF

F 2A

250 V

PAT 4563666

SMF Configuration

("Gull Wing" Surface Mount)

1.52

(.060")

0.08 (.003")

1.40 (.055")

15.24 (.600")

17.12 (.674)

4.06 (.160)

11.53 (.454)

2.79 (.110)

Recommended Pad Layout

Dimensions

Average Time Current Curves

100

10

1

0.01

0.001

1000

100

10

1

0.1

0.05

1/4A

1/2A 3/4A 1A

1 1/2A 2

A

2 1/2A 3A 4A 5A

TIME IN SECONDS

CURRENT IN AMPERES

.1

0203 002. HXG

Series
Amp Code

Refer to Amp Code column of
Electrical Characteristics Table

Quantity Code

HXG = 100
URG = 500

0203 002. H

Series
Amp Code

Refer to Amp Code column of
Electrical Characteristics Table

Quantity Code

H = 100

Soldering Parameters

Temperature Rerating Curve

Note:
1. Derating depicted in this curve is in addition to the standard derating of 25% for

continuous operation.

Wave Soldering

260°C, 3 seconds max.

Reflow Soldering

215°C, 30 seconds max.

Materials

Body: Thermoplastic

Terminations: Tin/Lead Plated Copper

Solderability

MIL-STD-202, Method 208.

Cleaning

Board washable in most common solvents.

Operating
Temperature

–55

O

C to 125

O

C

Product Characteristics

Part Numbering System

Surface Mount Fuses:

Through Hole Fuses:

Packaging

packaging

Option

packaging

Specification

Quantity

Quantity &

packaging Code

Surface Mount Fuses

Bulk

100

HXG

24mm Tape

and Reel

EIA 481

(IEC60286, part 3)

500

URG

Through Hole Fuses

Antistatic

Magazine

100

H