Littelfuse 157T Series - Manual (Page 3)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/19/13
Surface Mount Fuses
NANO 2® > 157T Fuse and Holder Combination
Materials
Body: Ceramic
Cap: For 0.375A ~ 5A – Silver plated Brass
Clip Plating: Matte Tin
Product
Marking Body: Brand Logo, Current Rating, “T” for
Time-Lag
Clip Retention
Force applied at fuse center, perpendicular to
the long axis (@0.75 lbs. MIN)
Solderability
MIL-STD-202, Method 208 / IPC/ EIA /
JEDEC J-STD002B, Test Condition A
Humidity Test
MIL –STD-202, Method 103 @ 85ºC / 85%RH,
1000 hours
Resistance to
Solvents
MIL-STD-202, Method 215 (3 solvent types)
Product Characteristics
Operating
Temperature
-55ºC to 125ºC with proper derating
Thermal Shock
MIL-STD-202, Method 107,
Test Condition B
(5 cycles -65ºC to +125ºC)
Vibration
MIL-STD-202, Method 201
(10-55 Hz)
Moisture Resistance
MIL-STD-202, Method 106,
10 cycles
Salt Spray/
Atmosphere
MIL-STD-202, Method 101,
Test Condition B (48 hrs.), 5% NaCl in
De-ionized Water
Shock
MIL-STD-202, Method 213,
Test Condition I (100 G’s peak for 6
milliseconds)
Dimensions
6.10
[0.240]
1.45
[0.057]
2.69
[0.106]
2.69
[0.106]
3.7 ± 0.13
[0.146]
L
1 A
F
6.50 ± 0.20
[0.256]
T
3.90 ± 0.13
[0.154]
2.50 ± 0.2
[0.098]
3.70
[0.146]
3.40
[0.134]
"A" "B"
0.10
7.26
[0.29]
3.00
[0.12]
2.46
[0.10]
2.40
[0.09]
Packaging
packaging
Option
packaging
Specification
Quantity
Quantity &
packaging Code
Tape and Reel Surface Mount 1500 DRT
Part Numbering System
0157 005. D R T
SERIES
AMP CODE
qUANTITY CODE
PACKING OPTION
D = 1500 pcs
R = Tape and Reel
PCB Recommendation for Thermal Management
1. Minimum Copper Layer Thickness = 100um
2. Minimum Copper Trace Width = 10mm
Note:
Alternate methods of thermal management may be used. In such cases, under normal
operations, the maximum temperature of the fuse body should not exceed 80ºC in a 25ºC
ambient environment.
TIME-LAG FUSE