Littelfuse SL1002A Series - Manual (Page 4)

©2009 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
38
Revised: November 10, 2009
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
SL1002A Series
SL1002A Series
Reflow Condition Pb-free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (Min to Max) (t
s
) 60 – 180 seconds
Average Ramp-up Rate (Liquidus Temp
(T
L
) to peak)
3°C/second max.
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max.
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of Actual Peak
Temperature (t
p
)
10 – 30 seconds
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature (T
P
) 8 minutes max.
Do not exceed 260°C
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Time
T
e
mperature
T
P
T
L
T
S(max)
T
S(min)
25
t P
t L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T
L
to T
P
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0 10 20 30 40 5 0 60 70 80 90 100 110 120 130 140 1
5 0
160 170 180 190 200 210 220 230 240
Time (Seconds)
T
emperature (°C) - Measured on
bottom side
of
board
Cooling Time Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature) (Typical Industry Recommendation)
Temperature Minimum: 100 ° C
Temperature Maximum: 150 ° C
Preheat Time: 60-180 seconds
Solder Pot Temperature: 280 ° C Maximum
Solder Dwell Time: 2-5 seconds
Recommended Process Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.