Littelfuse 2016L Series - Manual (Page 3)

47
Revised: March 19, 2012
POLY-FUSE ® Resettable PTCs
© 2012 Littelfuse, Inc
20
16L S
eries
Surface Mount > 2016L Series
2016L Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/2016L.html for current information.
Environmental Specifications
Soldering Parameters
Condition Reflow
Peak Temp/ Duration Time 260°C / 10 Sec
Time above liquids (TAL) 220°C 60 Sec ~ 100 Sec
Preheat 120°C~ 180°C 50 Sec ~ 150 Sec
Storage Condition ¡$_¡$
< =70%RH
t3FDPNNFOEFESFnPXNFUIPET*3
WBQPSQIBTFPWFO
IPUBJS
PWFO
/
2
environment for lead–free
t3FDPNNFOEFENBYJNVNQBTUFUIJDLOFTTJTNN JODI
t%FWJDFTDBOCFDMFBOFEVTJOHTUBOEBSEJOEVTUSZNFUIPETBOE
solvents.
Note: *GSFnPXUFNQFSBUVSFTFYDFFEUIFSFDPNNFOEFEQSPmMF
devices may not meet the performance requirements.
Operating/Storage
Temperature
-40°C to +85°C
Maximum Device Surface
Temperature in Tripped
State
125°C
Passive Aging
¡$
IPVST
-/+5% typical resistance change
Humidity Aging
¡$
3)
IPVST
-/+5% typical resistance change
Thermal Shock
.*-o45%o
.FUIPE(
+85°C/-40°C 20 times
-30% typical resistance change
Solvent Resistance
.*-o45%o
.FUIPE
/PDIBOHF
Vibration
.*-o45%o$
.FUIPE
Condition A
/PDIBOHF
Moisture Sensitivity Level -FWFM
+o45%o$
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Lead Solderability
.FFUT&*"4QFDJmDBUJPO34&
"/4*
+45%$BUFHPSZ
Preheating
120
180
220
260
0
60 to 100
Temperature (
°C)
Soldering Cooling
120 50 to 150
Time(s)