Littelfuse SP4060 Series - Manual (Page 3)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
TVS Diode Arrays
(SPA ® Diodes)
Lightning Surge Protection - SP4060 Series
Capacitance vs. Bias Insertion Loss (S21) I/O to GND
0.0
1.0
2.0
3.0
4.0
5.0
0.0 0.5 1.0 1.5 2.0 2.5
DC Bias (V)
Capacitance (pF)
-30
-25
-20
-15
-10
-5
0
5
0 0 0 0 1 0 0 0 1 0 0 1 0 1
Frequency (MHz)
Attenuation (dB)
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat Preheat
Ramp-up Ramp-up
Ramp-down Ramp-do
Critical Zone
T L to T P
Critical Zone
T L to T P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 3°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters
Package Dimensions — MSOP10
Package MSOP
Pins 10
JEDEC MO-187
Millimeters Inches
DIM Min Max Min Max
A - 1.10 - 0.043
A1 0.00 0.15 0.000 0.006
B 0.17 0.27 0.007 0.011
c 0.08 0.23 0.003 0.009
D 2.90 3.10 0.114 0.122
E 4.67 5.10 0.184 0.200
E1 2.90 3.10 0.114 0.122
e 0.50 BSC 0.020 BSC
L 0.40 0.80 0.016 0.032
B e A1
A
2 1
E1 E
10
D
L
C
0.32
[0.0126]
4.24
[0.1
669]
1.
04
[0.0409
] 5.28
[0.2079
]
3.20
[0.1
260]
0.50
[0.0197]
2.00
[0.0787]
Solder Pad Layout