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Surface mount fuses, Nano, Average time current curves – Littelfuse 443 Series User Manual

Page 2: Soldering parameters temperature rerating curve

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© 2013 Littelfuse, Inc.

Specifications are subject to change without notice.
Revised: 12/19/13

Surface Mount Fuses

NANO

> 250V > Time Lag > 443 Series

Average Time Current Curves

Reflow Condition

Pb – Free assembly

pre Heat

- Temperature min (T

s(min)

)

150°C

- Temperature max (T

s(max)

)

200°C

- Time (min to max) (t

s

)

60 – 120 secs

Average ramp up rate (liquidus Temp
(T

l

) to peak

5°C/second max.

T

S(max)

to T

l

- Ramp-up Rate

5°C/second max.

Reflow

- Temperature (T

l

) (liquidus)

217°C

- Temperature (t

l

)

60 – 90 seconds

peak Temperature (T

p

)

260

+0/–5

°C

Time within 5°C of actual peak
Temperature (t

p

)

20 – 40 seconds

Ramp-down Rate

5°C/second max.

Time 25°C to peak Temperature (T

p

)

8 minutes max.

Do not exceed

260°C

Soldering Parameters

Temperature Rerating Curve

0.001

0.01

0.1

1

10

100

0.1

1

10

100

1000

TIME IN SECONDS

CURRENT IN AMPS

0.50

A

0.75

A

1.00

A

1.50

A

2.00

A

2.50

A

3.00

A

3.50

A

4.00

A

5.00

A

Note:
1. Derating depicted in this curve is in addition to the standard derating of 25% for

continuous operation.

Wave Soldering parameters

260°C Peak

Temperature,

3 seconds max.

Time

Te

mperatur

e

T

P

T

L

T

S(max)

T

S(min)

25

t

P

t

L

t

S

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

T

L

to T

P