Littelfuse SG Series - Manual (Page 3)

Gas Discharge Tube (GDT) Products
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/25/13
SG Series
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (Min to Max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus Temp
(T
L
) to peak
3°C/second max
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t
p
)
10 – 30 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
P
) 8 minutes Max.
Do not exceed 260°C
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T
L
to T
P
Device Dimensions
4.5 +/- 0.3
2.7 +/- 0.3
0.5 +/- 0.1
5.2
2.8
3.2 +/- 0.3
Recommended Soldering Pad Layout
4
Dimensions in Millimeters.
Device Marking
Type
Code
A3A
Production
Year Code
(last digit)
Production
Month Code
Type Code
A SG75
B SG90
C SG150
D SG230
E SG300
F SG300Q
G SG350
H SG350Q
I SG400
J SG420
K SG420Q
L SG450Q
M SG500Q
N SG600Q
Month Code
A January
B February
C March
D April
E May
F June
G July
H August
I September
J October
K November
L December