Littelfuse SDP Biased Series SOT23-6 - Manual (Page 4)

SIDACtor ® Protection Thyristors
4
Revised: 11/04/13
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Broadband Optimized ™ Protection
SDP Biased Series SOT23-6
Dimensions
Inches Millimeters
Min Max Min Max
A - 0.057 - 1.450
A1 - 0.006 - 0.150
A2 - 0.051 - 1.300
b 0.014 0.020 0.350 0.508
C 0.004 0.008 0.090 0.200
D 0.110 0.118 2.800 3.000
E 0.102 0.118 2.600 3.000
E1 0.057 0.069 1.450 1.750
e - 0.037 - 0.950
e1 - 0.075 - 1.900
L (note 4.5) 0.004 0.023 0.100 0.600
N (note 6) 6 6
0°C 10°C 0°C 10°C
M - 0.102 - 2.590
O - 0.027 - 0.690
P - 0.039 - 0.990
R - 0.038 - 0.950
O
P
R
M
Recommended Solder Pad Layout
Notes:
1. Dimensioning and tolearances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992)
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Foot lenth L measured at reference to seatng plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
Dimensions - SOT23-6
Environmental Specifications
Temp Cycling
Mil-STD-883F, Method 1010.8 Condition
C, -65°C to +150°C
168 Hrs, 85°C /60%RH+3IR-Reflow,
260°C +5V, -0°C
Bias Humidity
JESD 22-A101-B 85°C , 85°CRH. 50V
168 Hrs, 85°C /60%RH+3IR-Reflow,
260°C +5V, -0°C
Pressure Cooker
JEDEC 22-A102C No Bias, 121°C,
100%RH 96Hrs/192Hrs.
168 Hrs, 85°C /60%RH+3IR-Reflow,
260°C +5V, -0°C
High Temp Storage JESD 22-A103C Con B. 150°C, no bias 1000Hrs
HTRB
JESD 22-108C
168 Hrs, 85°C /60%RH+3IR-Reflow,
260°C +5V, -0°C
Thermal Shock
Mil-STD-883F, Method 1011.9 Condition
A, 0°C to 100°C
168 Hrs, 85°C /60%RH+3IR-Reflow,
260°C +5V, -0°C
C-SAM
As per flow, JSTD-020C pre&post
preconditioning test.
Wet Humidity
(Tin only)
JESD 201A standard: 55°C/85%RH
Notes:
1. All dimensions are in millimeters.
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC MO-178
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte tine
Physical Specifications
Lead Plating SOT23: Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Subsitute Material Silicon
Body Material Molded Epoxy
Flammability UL94-V-0