Poly-fuse, Resettable ptcs, Surface mount > 0402l series – Littelfuse 0402L Series User Manual
Page 3

POLY-FUSE
®
Resettable PTCs
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/17/14
Surface Mount > 0402L Series
Environmental Specifications
Operating/Storage
Temperature
-40°C to +85°C
Maximum Device Surface
Temperature in Tripped State
125°C
Passive Aging
+85°C, 1000 hours
-/+10% typical resistance change
Humidity Aging
+85°C, 85% R.H.,100 hours
-/+15% typical resistance change
Thermal Shock
MIL–STD–202, Method 107G
+85°C/-40°C 20 times
-30% typical resistance change
Solvent Resistance
MIL–STD–202, Method 215
No change
Vibration
MIL–STD–883C, Method 2007.1,
Condition A
No change
Moisture Sensitivity Level
Level 1, J–STD–020C
Physical Specifications
Terminal Material
Solder-Plated Copper
(Solder Material: Matte Tin (Sn))
Lead Solderability
Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3.
Soldering Parameters
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
Preheat
Preheat
Ramp-up
Ramp-up
Ramp-down
Ramp-do
Critical Zone
t
L
to t
P
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (T
S(max)
to T
P
)
3°C/second max
Pre Heat:
Temperature Min (T
s(min)
)
150°C
Temperature Max (T
s(max)
)
200°C
Time (Min to Max) (t
s
)
60 – 180 secs
Time Maintained
Above:
Temperature (T
L
)
217°C
Temperature (t
L
)
60 – 150 seconds
Peak / Classification Temperature (T
P
)
260
+0/-5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (T
P
)
8 minutes Max.
-- All temperature refer to topside of the package, measured on the package body surface
-- If reflow temperature exceeds the recommended profile, devices may not meet the
performance requirements
-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N
2
environment for
lead
-- Recommended maximum paste thickness is 0.25mm (0.010 inch)
-- Devices can be cleaned using standard industry methods and solvents
-- Devices can be reworked using the standard industry practices