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Poly-fuse, Resettable ptcs, Surface mount > 0402l series – Littelfuse 0402L Series User Manual

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POLY-FUSE

®

Resettable PTCs

© 2014 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 01/17/14

Surface Mount > 0402L Series

Environmental Specifications

Operating/Storage
Temperature

-40°C to +85°C

Maximum Device Surface
Temperature in Tripped State

125°C

Passive Aging

+85°C, 1000 hours
-/+10% typical resistance change

Humidity Aging

+85°C, 85% R.H.,100 hours
-/+15% typical resistance change

Thermal Shock

MIL–STD–202, Method 107G
+85°C/-40°C 20 times
-30% typical resistance change

Solvent Resistance

MIL–STD–202, Method 215
No change

Vibration

MIL–STD–883C, Method 2007.1,
Condition A
No change

Moisture Sensitivity Level

Level 1, J–STD–020C

Physical Specifications

Terminal Material

Solder-Plated Copper
(Solder Material: Matte Tin (Sn))

Lead Solderability

Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3.

Soldering Parameters

Time

Te

mperatur

e

T

P

T

L

T

S(max)

T

S(min)

25

t

P

t

L

t

S

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Critical Zone

t

L

to t

P

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (T

S(max)

to T

P

)

3°C/second max

Pre Heat:

Temperature Min (T

s(min)

)

150°C

Temperature Max (T

s(max)

)

200°C

Time (Min to Max) (t

s

)

60 – 180 secs

Time Maintained
Above:

Temperature (T

L

)

217°C

Temperature (t

L

)

60 – 150 seconds

Peak / Classification Temperature (T

P

)

260

+0/-5

°C

Time within 5°C of actual peak
Temperature (t

p

)

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (T

P

)

8 minutes Max.

-- All temperature refer to topside of the package, measured on the package body surface

-- If reflow temperature exceeds the recommended profile, devices may not meet the

performance requirements

-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N

2

environment for

lead

-- Recommended maximum paste thickness is 0.25mm (0.010 inch)

-- Devices can be cleaned using standard industry methods and solvents

-- Devices can be reworked using the standard industry practices