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Surface mount fuses, Nano, Very fast-acting > 448 series – Littelfuse 448 Series User Manual

Page 3: Average time current curves, Soldering parameters temperature rerating curve, Time te mperatur e t

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© 2013 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 12/19/13

Surface Mount Fuses

NANO

> Very Fast-Acting > 448 Series

Average Time Current Curves

Reflow Condition

Pb – Free assembly

pre Heat

- Temperature min (T

s(min)

)

150°C

- Temperature max (T

s(max)

)

200°C

- Time (min to max) (t

s

)

60 – 120 secs

Average ramp up rate (liquidus Temp
(T

l

) to peak

5°C/second max.

T

S(max)

to T

l

- Ramp-up Rate

5°C/second max.

Reflow

- Temperature (T

l

) (liquidus)

217°C

- Temperature (t

l

)

60 – 90 seconds

peak Temperature (T

p

)

260

+0/–5

°C

Time within 5°C of actual peak
Temperature (t

p

)

20 – 40 seconds

Ramp-down Rate

5°C/second max.

Time 25°C to peak Temperature (T

p

)

8 minutes max.

Do not exceed

260°C

Wave Soldering parameters

260°C Peak

Temperature, 10

seconds max.

Soldering Parameters

Temperature Rerating Curve

448 SERIES NANO LEAD FREE VERY FAST ACTING FUSE

0.001

0.01

0.1

1

10

100

0

0

0

1

0

0

1

0

1

1

1

.

0

CURRENT IN AMPS

TIME IN SECONDS

.062

A

.080

A

.100

A

.125

A

.160

A

.200

A

.250

A

.315

A

.375

A

.40

A

.50

A

.63

A

.75

A

.80

A

1.00

A

1.25

A

1.50

A

1.60

A

2.00

A

2.50

A

3.00

A

3.15

A

3.50

A

4.00

A

5.00

A

6.30

A

7

A

8

A

10

A

12

A

15

A

Note:
1. Derating depicted in this curve is in addition to the standard derating of 25% for

continuous operation.

Time

Te

mperatur

e

T

P

T

L

T

S(max)

T

S(min)

25

t

P

t

L

t

S

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

T

L

to T

P