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Pulse-guard, Esd suppressors – Littelfuse PGB2 0201 Series User Manual

Page 3

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©2012 Littelfuse

Specifications are subject to change without notice.

PULSE-GUARD

®

ESD Suppressors

Surface Mount Polymeric Electrostatic Discharge Suppressors

Revised: August 24, 2012

PGB2 0201 Series

Environmental Specifications

Operating Temperature

¡$UP¡$

Biased Humity:

Biased Heat:

¡$ 3) IPVST

¡$ IPVST

Thermal Shock

.*-45% .FUIPE(
¡$UP¡$ NJODZDMF
10 cycles

Vibration

.*-45% .FUIPE"

Chemical Resistance

.*-45% .FUIPE

Solder Leach Resistance and
Terminal Adhesion

*1$&*"+45%

Physical Specifications

Materials

#PEZ&QPYZ(MBTT4VCTUSBUF
5FSNJOBUJPOT$V/J4O

Device Weight

NH

Solderability

.*-45% .FUIPE

Soldering
Parameters

8BWFTPMEFS¡$ TFDPOETNBYJNVN
3FnPXTPMEFS¡$ TFDPOETNBYJNVN

Design Consideration

Because of the fast rise-time of the ESD transient, proper
placement of PULSE-GUARD

®

TVQQSFTTPSTBSFBLFZ

design consideration to achieving optimal ESD suppression.
The devices should be placed on the circuit board as close
to the source of the ESD transient as possible. Install
PULSE-GUARD

®

TVQQSFTTPST DPOOFDUFEGSPNTJHOBMEBUB

line to ground) directly behind the connector so that they
are the first board-level circuit component encountered by
the ESD transient.

Soldering Parameters

Time

T

emperature

T

P

T

L

T

S(max)

T

S(min)

25

t

P

t

L

t

S

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Reflow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min)

)

¡$

- Temperature Max (T

s(max)

)

¡$

- Time (min to max) (t

s

)

60 – 180 seconds

Average ramp up rate (Liquidus Temp
(T

L

) to peak

¡$TFDPOENBY

T

S(max)

to T

L

- Ramp-up Rate

¡$TFDPOENBY

Reflow

- Temperature (T

L

) (Liquidus)

¡$

- Temperature (t

L

)

oTFDPOET

Peak Temperature (T

P

)

¡$

Time within 5°C of actual peak
Temperature (t

p

)

oTFDPOET

Ramp-down Rate

¡$TFDPOENBY

Time 25°C to peak Temperature (T

P

)

NJOVUFTNBY

Notes:

- PGB2 Series recommended for reflow soldering only

3FDPNNFOEFEQSPmMFCBTFEPO*1$+&%&%+45%$

- For recommended soldering pad layout dimensions,
please refer to Dimensions section of this data sheet