Littelfuse 485 Series - Manual (Page 2)

© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 01/23/14
Surface Mount Fuses
Nano 2® > 600VDC > Fast-Acting 485 Series
Average Time Current Curves Temperature Rerating Curve
T
IM
E
IN
SE
C
O
ND
S
CURRENT IN AMPERES
0.001
0.01
0.1
1
10
100
0.1 1 10 100 1000
2A 1.
5A
1A 2.5
A
3.15
A
Reflow Condition Pb – Free Assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (Min to Max) (t
s
) 60 – 180 ses
Average Ramp-up Rate (Liquidus Temp
(T
L
) to peak)
5°C/second max.
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max.
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260 +0/–5 °C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate 5°C/second max.
Time 25°C to peak Temperature (T
P
) 8 minutes max.
Do not exceed 260°C
Soldering Parameters - Reflow Soldering
Time
Te
mperatur
e
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T L to T P