Littelfuse 396 Series - Manual (Page 2)

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/19/13
Radial Lead Fuses
TE5 ® > Time-Lag > 396 Series
Average Time Current Curves
Soldering Parameters - Wave Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time Preheat Time
Wave parameter lead-Free Recommendation
preheat:
(Depends on Flux Activation Temperature) (Typical Industry Recommendation)
Temperature Minimum: 100 ° C
Temperature Maximum: 150 ° C
Preheat Time: 60-180 seconds
Solder pot Temperature: 260 ° C Maximum
Solder Dwell Time: 2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reflow process.
Recommended Process Parameters:
CURRENT IN AMPERES
TIME IN SECONDS
0.001
0.010
0.100
1
10
100
1000
10000
100000
0.100 1 10 100 0.02
0.
050A
0.
063A
0.
080A
0.
100A
0.
125A
0.
160A
0.
200A
0.
250A
0.
315A
0.
400A
0.
500A
0.
630A
0.
800
A
1.
00
A
1.
25
A
1.
60
A
2.
00
A
2.
50
A
3.
15
A
4.
00
A
5.
00
A
6.
30
A
Temperature Rerating Curve
0
20
40
60
80
100
120
140
-40 -20 0 20 40 60 80
AMBIENT TEMPERATURE (°C)
PE
RCE
NT
OF
RA
TI
NG
23°C